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1

Rapid power cycling of flip-chip and CSP components on ceramic substrates

Jaakko Lenkkeri, Tuomo Jaakola

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 256 KB

english, 2001

2

Laser-induced deposition and etching of materials: A new technology for sensor fabrication

Markus Turunen, Jaakko Lenkkeri, Juhani Levoska, Seppo Leppävuori

Journal:

Sensors and Actuators

Year:

1989

Language:

english

File:

PDF, 334 KB

english, 1989

3

LTCC TECHNOLOGY FOR PHOTONIC AND MILLIMETER WAVE MODULE INTEGRATION

KERÄNEN, KIMMO, KARPPINEN, MIKKO, LENKKERI, JAAKKO, MÄKINEN, JUKKA-TAPANI, OLLILA, JYRKI, KARIOJA, PENTTI

Journal:

International Journal of Software Engineering and Knowledge Engineering

Year:

2005

Language:

english

File:

PDF, 944 KB

english, 2005

4

Laser-assisted direct writing of strain sensitive silicon resistors

Jaakko Lenkkeri, Seppo Leppävuori

Journal:

Sensors and Actuators A: Physical

Year:

1990

Language:

english

File:

PDF, 1.05 MB

english, 1990

5

Congenital nephrotic syndrome (NPHS1): Features resulting from different mutations in Finnish patients

Patrakka, Jaakko, Kestilä, Marjo, Wartiovaara, Jorma, Ruotsalainen, Vesa, Tissari, Päivi, Lenkkeri, Ulla, Männikkö, Minna, Visapää, Ilona, Holmberg, Christer, Rapola, Juhani, Tryggvason, Karl, Jalanko

Journal:

Kidney International

Year:

2000

Language:

english

File:

PDF, 531 KB

english, 2000

6

Improved prenatal diagnosis of the congenital nephrotic syndrome of the Finnish type based on DNA analysis

Männikkö, Minna, Kestilä, Marjo, Lenkkeri, Ulla, Alakurtti, Heli, Holmberg, Christer, Leisti, Jaakko, Salonen, Riitta, Aula, Pertti, Mustonen, Aki, Peltonen, Leena

Journal:

Kidney International

Year:

1997

Language:

english

File:

PDF, 465 KB

english, 1997

7

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Low Cost Printed Flexible Multilayer Substrates

Jaakola, Tuomo, Lahti, Markku, Petaja, Jarno, Kautio, Kari, Ronka, Kari, Lenkkeri, Jaakko

Year:

2008

Language:

english

File:

PDF, 5.16 MB

english, 2008

8

Conductive adhesives as die-bonding materials for power electric modules

LENKKERI, JAAKKO, RUSANEN, OUTI

Journal:

Journal of Electronics Manufacturing

Year:

1993

File:

PDF, 479 KB

1993

9

SPIE Proceedings [SPIE International Symposium on Microelectronics and MEMS - Adelaide, Australia (Monday 17 December 2001)] Device and Process Technologies for MEMS and Microelectronics II - MEMS sensor packaging using LTCC substrate technology

Kopola, Harri K., Lenkkeri, Jaakko, Kautio, Kari, Torkkeli, Altti, Rusanen, Outi, Jaakola, Tuomo, Chiao, Jung-Chih, Faraone, Lorenzo, Harrison, H. Barry, Shkel, Andrei M.

Year:

2001

Language:

english

File:

PDF, 1001 KB

english, 2001

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